Nostra Services: One-subsisto PCB et PCBA electronic muneris fabricandis
● PCB operandi officium: Necessitas fasciculus Gerber (CAM350 RS274X), fasciculi PCB (Protel 99, AD, Aquila), etc.
Components transnationale officia: BOM album inclusa detailed Partis numeri et designatoris
● PCB conventus officia: Tabulae superiores et delige et locum fasciculi, conventus extractionem
● programmandi & Testandi officia: Programma, instructio ac probatio methodi etc.
Praesent conventus officia: 3D files, gradus vel alii
Reverse ipsum officia: Exempla et alii
Cable & filum conventus officia: Specification & alii
Alii officia: Value-added officia
PCB Technical Capacity
Stratis | Massa productio: 2~58 strata / Gubernator currit: 64 stratis |
Maximilianus.Crassitudo | Massa productio: 394mil (10mm) / Gubernator currit: 17.5mm |
Materia | FR-4 (Latin FR4, Mid-Tg FR4, Hi-Tg FR4, Materia collecta libera), Halogen-Free, Ceramica repleta, Teflon, Polyimide, BT, PPO, PPE, Hybrida, Hybrida partialis, etc. |
Min.Latitudo / Spacing | Iacuit interior: 3mil/3mil (HOZ), tegumen externum: 4mil/4mil(1OZ) |
Maximilianus.Crassitudo aeris | UL certificatorium: 6.0 OZ / Gubernator run: 12OZ |
Min.Foraminis Size | Terebra mechanica: 8mil(0.2mm) Laser terebra: 3mil(0.075mm) |
Maximilianus.Panel Size | 1150mm 560mm |
Rationem ratio | xviii 18; |
Superficiem Conclusio | HASL, immersio Aurum, immersio plumbi, OSP, ENIG + OSP, immersio Argenti, ENEPIG, Digitus Aurum. |
Processus specialis | Sepultus Hole, Foramen Caecum, Resistentia Embedded, Capacitas Embedda, Hybrida, Partialis Hybrida, Partialis densitas, Back EXERCITATIO, Resistentia Resistentia. |
PCB Technical Capacity
SMT | Position accurate: XX um |
Components size:0.4×0.2mm(0105) —130×79mm, Flip-SCIPIUM, QFP, BGA, POP | |
Maximilianus.pars altitudo ::25mm | |
Maximilianus.PCB size:680×500mm | |
Min.PCB magnitudine: non limitata | |
Crassitudo PCB: 0,3 ad 6mm | |
PCB pondus: 3KG | |
Fluctus Solder | Maximilianus.PCB width:450mm |
Min.PCB width: non limitata | |
Component height: Top 120mm/Bot 15mm | |
Sudor-Solder | Metallum genus: pars, totum, inlay, incedit |
Materia metalla: Aeris, aluminium | |
Superficies Conclusio: plating Au, plating novaculata plating Sn | |
Aeris vesicae rate: minus quam XX% | |
Press-fit | Press range: 0-50KN |
Maximilianus.PCB size: 800X600mm | |
Testis | ICT, Probe volans, ardeat in, function test, temperatura cycling |